PCB stack-up

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Multilayers Rigid PCB stack up

Our standard multi-layer PCB stackup is predominantly made up of three components

 with varying thicknesses of Copper Foil, Pre-preg and Copper clad FR4 laminates as cores

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Multilayers FPC stack-up

Multilayers Flexible circuit boards stack-up , PI ,base copper with or without adhesive

,overlay , the thickness is from 0.15mm-0.5mm.

          

 

 

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Blind Vias :  connects an inner layer with the adjacent surface layer, they are only

 visible on one side of the boards and so are called ‘blind’ Vias.

Buried Vias: Connects two adjacent inner copper layers. They are not visible from

 the surface and so are ‘buried’

 

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Copper in the wall of PTH

 The thickness of copper in the wall of PTH hole as 25 at least

 

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Side Plating

To guarantee the producibility of the side plating, the metallized area must be

 defined using overlapping copper (copper surface, pads, or tracks) in the CAD

 layout. Minimum overlap:500um On the connected layer, min 300um of connected

 copper must be defined. On non-connected layers, the copper should have gap of

min. 800um from the outer contour

 

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